NF5280A6_ Rack and Tower Servers_meta brain® General Purpose Servers

Key Features

Powerful Performance

1. Employing the 3^rd Gen AMD® EPYC™ Milan Processors, NF5280A6 supports up to 64 cores and 128 threads per CPU, up to 280 W TDP, a maximum Turbo frequency of 3.7 GHz, and 256 MB L3 cache per CPU and XGMI2 interconnect links at 18 GT/s.
2. Up to 32 DDR4 ECC memory modules (up to 3200 MT/s, RDIMMs and LRDIMMs), with the maximum capacity of 4 TB[JC(1] , are supported to deliver a high speed and superior availability.
Flexible Expansion

1. Support up to 16 × 3.5" drive or 28 × 2.5" drive.
2. Support optional OCP NIC 3.0 module with multiple network port options (10/25/40/100/200 Gbps), delivering a more flexible network architecture to applications.
3. Support up to 8 standard PCIe expansion cards, further enhancing I/O performance.
4. Support optional internal SATA/PCIe M.2 modules for diverse storage demands.
Smart Management

1. With a user-friendly design, the entire system supports tool-free maintenance. The enhanced and optimized structures realize easy assembly/disassembly and greatly reduce O&M time.
2. IEIT's unique intelligent regulating technology combined with an advanced air cooling system creates an optimum working environment to ensure server health.
3. With the latest BMC, technicians can quickly locate components that have failed (or are failing) through the Web GUI, fault diagnosis LEDs and UID LEDs on the front panel, simplifying maintenance, speeding up troubleshooting, and enhancing system availability.
4. Technicians can monitor system parameters and take appropriate actions in a timely manner via the alarms sent in advance via BMC to ensure system health and minimize system downtime.

Technical Specifications

Item	Description
Form Factor	2U rack server
Processor	1. One or two AMD® EPYCTM® Milan series processors 2. Up to 64 cores (Base frequency of 2.45 GH [JC(1] z) 3. Max. Turbo frequency at 3.7 GHz 4. 256 MB L3 cache per CPU and XGMI2 interconnect links at 18 GT/s 5. TDP up to 280 W
Memory	1. Up to 32 DIMMs [a2] 2. 8 memory channels per processor, and up to 2 memory slots per channel 3. Up to 3200 MT/s (1DPC) 4. RDIMMs and LRDIMMs supported 5. ECC, memory mirroring and memory rank sparing
Storage	Front drive 24 × 2.5" hot-swap SATA/SAS/NVMe drive 12 × 2.5" or 3.5" hot-swap SATA/SAS/NVMe drive Rear drive 4 × 2.5" hot-swap SATA/SAS/NVMe SSD drive 4 × 3.5″ (or 2.5") SATA/SAS/NVMe SSD drive (hot-swap) Internal drive 2 optional SATA M.2 drives or 1 PCle M.2 drive + 1 SATA M.2 drive
Storage Controller	Standard PCle RAID card controller and SAS card controller
Network Port	1 optional OCP NIC 3.0 module (10 Gbps, 25 Gbps, 40 Gbps, 100 Gbps, and 200 Gbps) 2 optional onboard 1-Gbps electrical ports Standard PCIe form factor: 1 Gbps/10 Gbps/25 Gbps/40 Gbps/100 Gbps NIC
I/O Expansion Slot	Up to 8 PCIe slots Up to 2 double-width GPUs or 4 single-width GPUs 1 hot-swap OCP NIC 3.0 (x16)
Interface	2 rear USB 3.0 ports + 1 front USB 3.0 port + 1 front USB 2.0 port 1 front VGA port 1 rear VGA port
Fan	4 hot-swap fans with N+1 redundancy
PSU	550 W/800 W/1300 W/1600 W/2000 W CRPS standard PSUs with 1+1 redundancy
System Management	Integrated with 1 independent 1000 Mbps network port, dedicated for IPMI remote management
Operating System	Microsoft Windows Sever, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS, etc.
Dimensions	With mounting ears: 478.8 × 87 × 811.7 mm (18.85 in × 3.43 in × 31.96 in) (W × H × D) Without mounting ears: 435 × 87 × 780 mm (17.13 in × 3.43 in × 30.71 in) (W × H × D)
Weight	< 37.5 kg (82.67 lbs) (with all drives loaded) (For details, please refer to the white paper)
Operating Temperature	5°C – 45°C (41°F – 113°F) (For details, please refer to the white paper)