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NF5180G7
NF5180G7

NF5180G7

Platform
Intel
Introduction

The NF5180G7 series maximizes the performance, computing density, and scalability in a 1U space and is suitable for a variety of computing-intensive service scenarios such as virtualization. With rich storage matrices, the NF5180G7 meets the needs of scalability and network balance to the greatest extent. It also satisfies the low-PUE needs of more high-density data centers by integrating multi-dimensional cooling solutions such as air cooling, cold plate cooling, and immersion cooling in the 1U models.

Key Features
  • Excellent performance and high efficiency
    Excellent performance and high efficiency
  • Flexible configurations and outstanding scalability
    Flexible configurations and outstanding scalability

    The NF5180G7 series supports up to 12 2.5-inch SAS/SATA/NVMe drives or 32 E1.S SSDs at the front, and up to 2 2.5-inch SAS/SATA drives at the rear (refer to the specific configurations). 

    Supports PCIe 5.0/4.0, up to 2 optional hot-swappable OCP 3.0, and provides 1 Gb, 10 Gb, 25 Gb, 40 Gb, 100 Gb, 200 Gb, and 400 Gb network interfaces. 

    With Compute Express Link (CXL), an open-source and standard cache-coherent interconnect protocol, and E3.S storage medium, the NF5180G7 provides caching media in addition to traditional DIMMs to meet the core needs of large-capacity cache services.

  • Security, reliability, and smart O&M
    Security, reliability, and smart O&M

    The front I/O design enables O&M personnel to operate in the cold aisle, which simplifies O&M operations, extends the service life of thermo-sensitive components such as optical modules and smart NICs, and improves data stability. 

    The redundancy design of core components, such as the BIOS and BMC, ensures that the system can start by switching to the standby flash, ensure that the system can start by switching to the standby chip,and supports the online upgrade of the BMC without suspending services, thus guaranteeing service continuity. 

  • High efficiency, carbon emission reduction, and energy conservation
    High efficiency, carbon emission reduction, and energy conservation

    Supports cold plate cooling and immersive cooling, and provides comprehensive liquid-cooling solutions for data centers. With full-stack liquid-cooling capabilities, the NF5180G7 series can drop the PUE of data centers to below 1.1. 

    By working with unique zonal intelligent control technology, the NF5180G7 series can adjust the fan speed intelligently based on the power consumption of components in different air ducts, eliminating temperature transmission delays and realizing energy-saving fan speed regulation and accurate air supply. 

    With the focus on environmental protection, key components of the series meet the lead-free requirements (RoHS), and all packaging and packing materials are recyclable.

Technical Specifications

Item

Description

Form Factor

1U rack server

Processor

Up to two 4th/5th Gen Intel® Xeon® Scalable processors

Up to 64 cores, with a max Turbo frequency of 4.2 GHz

4 UPI links per CPU and up to 20 GT/s per link

TDP up to 350 W

Chipset

Intel Emmitsburg

Memory

Up to 32 DDR5 DIMMs (5,600 MT/s)

16 DIMMs per CPU and 32 DIMMs for 2 CPUs

RDIMMs supported

Storage Drive

General

Front I/O

Front: 

32 × E1.S SSD 

12 × 2.5-inch SAS/SATA/NVMe drive (up to 12 NVMe SSDs) 

 10 × 2.5-inch SAS/SATA/NVMe drive 

8 × 2.5-inch SAS/SATA/NVMe drive + 2 × M.2 SSD + 2 × E1.S SSD 

4 × 3.5-inch SAS/SATA/NVMe drive + 2 × M.2 SSD + 2 × E1.S SSD 

4 × 3.5-inch SAS/SATA/NVMe drive + 4 × 2.5-inch SAS/SATA/NVMe drive

Front:

12 × E1.S SSD + 2 × M.2 SSD

4 × E3.S SSD/4 × 2.5-inch SAS/SATA/NVMe drive

Rear:

2 × 2.5-inch SAS/SATA drive (hot-swap)

-

Internal Storage

Up to 3 TF cards (1 for BMC and 2 for PCH)

Up to 2 SATA M.2 SSDs or 2 PCIe x4 M.2 SSDs

Storage Controller

RAID/SAS controller

Onboard PCH that supports 14 SATA connectors

Intel onboard NVMe controller and optional Intel NVMe RAID Key

Network

2 × optional hot-swap OCP 3.0 module

3 × optional hot-swap OCP 3.0 module

I/O Expansion Slot

Up to 6 PCIe expansion slots, including 1 mezz RAID and 2 hot-swappable OCP 3.0 

Up to 4 PCIe expansion slots for cold-plated configuration, including 2 hot-swappable OCP 3.0

Up to 8 PCIe expansion slots, including 1 RAID mezzanine, 3 hot-swappable OCP 3.0 (1 for front, 2 for rear)

Port

Front:

1 × USB 2.0 port

1 × USB 3.0 port

1 × DB15 VGA port

1 × type-C port

Rear:

2 × USB 3.0 port

1 × DB15 VGA port

1 × COM port (Micro USB)

1 × RJ45 port

Internal:

1 × USB 3.0 port

Front:

1 × USB 2.0 port

1 × USB 3.0 port

1 × DB15 VGA port

1 × RJ45 port

Rear:

2 × USB 3.0 port

1 × DB15 VGA port

1 × COM port (Micro USB)

1 × RJ45 port

Internal:

1 × USB 3.0 port

Fan

8 hot-swap dual-rotor fans with N+1 redundancy (none for immersive cooling models)

Power Supply

Supports 550W/800W/1,300W/1,600W/2,000W CRPS standard PSUs with 1+1 redundancy

System Management

Integrated with 1 independent 1,000 Mbps network port, dedicated to IPMI remote management

Security Features

Two-factor authentication, TPM 2.0, security panel, intrusion alert, BIOS/BMC chipset-level redundancy, power capping, etc.

Operating System

Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS, etc.

Dimensions
  (H × W × D)

10 × 2.5-inch drive configuration (equipped with conventional heatsinks)

With mounting ears: 43 × 482 × 830 mm (1.69 × 18.98 × 32.68 in.)

Without mounting ears: 43 × 438 × 815 mm (1.69 × 17.24 × 32.09 in.)

12 × 2.5-inch drive configuration:

With mounting ears: 43 × 482 × 881 mm (1.69 × 18.98 × 34.69 in.)

Without mounting ears: 43 × 438 × 858 mm (1.69 × 17.24 × 33.78 in.)

Other configurations:

With mounting ears: 43 × 482 × 880 mm (1.69 × 18.98 × 34.65 in.)

Without mounting ears: 43 × 438 × 865 mm (1.69 × 17.24 × 34.06 in.)

Weight

Full configuration: <31 kg (68.34 lbs) (For details, see the white paper)

Operating Temperature

5°C to 50°C (41°F to 122°F) (For details, see the white paper)


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