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Home Products meta brain® General Purpose Servers Rack and Tower Servers i24G7
i24G7
i24G7
i24G7
i24G7
i24G7
i24G7

i24G7

Platform
Intel
AMD

Air Cooling: i24-M7-A0-R0-00

Liquid Cooling: i24-M7-C0-R0-00

Air Cooling: i24-A7-A0-R0-00

Liquid Cooling: i24-A7-C0-R0-00

Introduction

i24G7 is latest 2U 4-node server which is optimized for data center and high-speed computing. i24G7 is powered by 8x latest AMD EPYC™ 9004 series Processors with liquid cooling solution covering CPU, memory and VR module, meet low PUE requirements. i24G7 is optimized in terms of heat dissipation, power supply, monitoring and management to meet the requirements of customers for the ultimate performance experience and new generation of high-density energy-saving data centers.

Key Features
  • Extreme Performance
    Extreme Performance

    Powered by 8x latest AMD EPYC™ 9004 series Processors

    Each node supports 24 DDR5 DIMM ,Up to 6TB

    Support NDR InfiniBand,providing high-bandwidth node interconnection

  • High Efficiency Liquid Cooling
    High Efficiency Liquid Cooling

    Reliable full cold-plate liquid cooling design for CPU+DIMM+VR, meet low PUE requirements

    Less cooling devices deployment in data center, significantly optimizing datacenter TCO

  • Intelligent Maintenance
    Intelligent Maintenance

    Precise water leakage detection, leakage node can be located accurately and powered off automatically, effectively reducing risks

    3D dynamic management for cabinet environment monitoring temperature, humidity and leakage information in real time, achieving intelligent maintenance

  • Flexible Deployment
    Flexible Deployment

    Integrated and simplified delivery of the whole cabinet

    Exclusive air-liquid CDU solution, quickly deploying liquid-cooled system without data center modification

    Supporting Liquid-liquid CDU, one-site agile deployment of datacenter

Technical Specifications

Model

i24-A7-A0-R0-00 (Air cooling) /i24-A7-C0-R0-00 (Liquid cooling)

Specifications

4 independent hot-swappable nodes in 2U Chassis

Storage

Config 1: 8*2.5 inches SATA/NVMe SSD (7mm)

Config 2: 4*2.5 inches SATA/NVMe SSD (15mm)

PSU

4*2200W Platinum/Titanium PSUs or 2700W Titanium PSUs, support N+N redundancy

Cooling

Air cooling: Four or five 8086 fans in the front of the chassis, N+1 redundancy

Liquid cooling: 2x8080 fans in the front of the chassis,  N+1 redundancy, node liquid cooling

Chassis

447mm(W)*87mm(H)*896mm(D), without chassis lugs

447mm(W)*87mm(H)*921mm(D), with lugs

Operating temperature

Air cooling: 5℃~40℃

Liquid cooling: 5℃~45℃

Weight

net weight:<54kg (fully equipped);

gross weight:<80kg (host+package+rail+accessory+pallet)

Air cooling and liquid cooling are different, refer to the technical white paper for details

Node

NS5180-A7-A0-R0-00 (Air cooling) / NS5180-A7-C0-R0-00 (Liquid cooling)

Specifications

1U half-width 2-socket compute node

CPU

2*AMD EPYC™ 9004 series Processors per node,  4 GMI links,

TDP 400W(The operating temperature is limited when 400W CPU is supported under air cooling);

Supports 500W CPU under liquid cooling

Memory

24 DDR5 4800MHz RDIMM per node

PCIe expansion

Air cooling: 1 PCIe 5.0 x16+1 PCIe 4.0 x16 slots per node

Liquid cooling: 1 PCIe 5.0 x16 slot per node

IO

Front:   2*USB2.0,1*VGA, 1*PWR button, 1*UID

Rear: 1*RJ45, 1*UID, 1*RST button, 1*micro USB for debug, 1*micro USB

Storage

Config 1: 2*2.5 inches SATA/NVMe SSD(7mm) per node

Config 2: 1*2.5 inches SATA/NVMe SSD(15mm) per node

2*SATA/PCIe M.2 per node

BMC

Aspeed AST2600

TPM

TPM2.0

NIC

1*OCP 3.0 card per node,can also support PCIe network card

OS

Red Hat Enterprise Linux8.6/9.0、SLES 15、CentOS 8、Ubuntu 22.04.01,etc


Relevant Information

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